Pay in 4 interest-free payments of $10.04 Learn more
Ships within 48 hours · Estimated delivery Aug 4 - Aug 9
2 V Memory ranking 1 ECC Yes Memory clock speed 2933 MHz Internal memory type DDR4 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC Memory form factor 288-pin DIMM CAS latency 21 Memory voltage 1
2 V Design Backlight No Technical details Chips organisation 1Rx8 Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 260-pin SO-DIMM CAS latency 17 Memory voltage 1
5 V Design Cooling type Heatsink Technical details Cooling type Heatsink Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC/server Memory form factor 240-pin DIMM CAS latency 11 Memory voltage 1
35 V Design Cooling type Heatsink Technical details Cooling type Heatsink Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC/server Memory form factor 240-pin DIMM CAS latency 9 Memory voltage 1
Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3
Hypertec 03T8408-HY (Legacy) memory module 2 GB 1 x 2 GB DDR3 1333 MHz ECC DDR 2 V Memory ranking 1A Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to
